A technique for attaching chips to a printed circuit board. Tiny globes of solder are attached to the bonding pads on the chip and then melted in place on the board. See BGA and flip chip.

Also called a "solder bump." See BGA. THIS DEFINITION IS FOR PERSONAL USE ONLY. All other reproduction requires permission.

Tucson, AZ USA Abstract : Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the ...

Solder paste stencils speed up the process when ... the board they’re pasting up is a stepper driver board for the BeagleBone named Bumps.

Wire bonds exhibit large electrical parasitics, while flip-chip-bonded solder bumps are prone to mechanical failures, particularly in heat-dissipating microchips. TriChipLink eliminates these issues ...

DUJUD develops TriChipLink - enabling chip designers to integrate multiple silicon microdevices into a 3D electronic ...