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2025年慕尼黑上海电子生产设备展
为适应日益复杂的探针卡,XL版本支持最大810 x 675毫米的电路板,并可选择升级以支持最大12毫米的厚度。这些提升确保了Seica 的飞针技术始终处于半导体和PCB测试领域的前沿。
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