A study reveals microwave annealing enhances hydrogen activation in hydrogen-rich dielectrics, offering a superior alternative to conventional N2 annealing.

The company uses these systems for research and development purposes, and so far, Intel has processed tens of thousands of wafers using them. Intel installed and started using two High-NA EUV ...

Article subjects are automatically applied from the ACS Subject Taxonomy and describe the scientific concepts and themes of the article. In Voroshnin et al., (27) the crystallographic structures of ...

The mechanism of UVID for TOPCon modules According to recent reports, the mechanism underlying UVID in PV modules is primarily linked to the properties and behaviour of the passivation layer.

The government and industry groups are working on reducing power and water costs as they aspire to put up the first wafer fabrication facility in the country and meet the “evolving” demands of ...

TL;DR: TSMC is advancing its 2nm process node, with production capacity expected to reach 50,000 to 80,000 wafers monthly by year-end. TSMC is reportedly experiencing healthy development progress ...