CMP Pads - DuPont
DuPont is a global leader in polishing pads, slurries and application expertise for chemical mechanical planarization (CMP) serving the semiconductor chip manufacturing industry and …
Visionpad™ Polishing Pads - DuPont
The Visionpad™ pad series for chemical mechanical planarization (CMP) is a platform designed for multiple applications and advanced nodes. Visionpad™ technology is engineered with …
2016年4月7日 · CMP Pad Characterization Capabilities within Dow Variety of characterization capabilities have been developed within Dow for CMP fundamentals, applications and process …
Dow Launches Next-Generation CMP Polishing Pad Platform
2012年9月5日 · Dow Electronic Materials’ IKONIC™ pad platform sets a new benchmark for CMP, drawing on the company’s expertise in materials science, polishing, manufacturing and …
Dow Electronic Materials launches CMP polishing pads
Dow Electronic Materials, a business unit of The Dow Chemical Company, today introduced the IKONIC 4000 series of chemical mechanical planarization (CMP) polishing pads. This series of …
CMP Pads - DuPont
DuPont’s polishing pad portfolio sets the standard for chemical mechanical planarization (CMP) in semiconductor manufacturing. Our wide range of hard and soft CMP pads are designed to …
Dow launches CMP polishing pad platform | Semiconductor Digest
Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), introduced its new IKONIC polishing pad platform for chemical mechanical planarization …
CMP Pads - Entegris
Our portfolio of CMP pads provides exact hardness, pore sizes, and compressibility to meet CMP application requirements. Using thermoset polyurethane technologies, our NexPlanar pads …
IC1000™ CMP Pads - DuPont
The IC1000™ series of pads for chemical mechanical planarization (CMP) is the industry standard. DuPont’s IC1000™ pads are used in a wide variety of CMP applications today. …
•The core roughness of Type 1 pads can be driven across a wide range with pad conditioning •Pad analysis reveals changes in the pad surface structure associated with polishing indicating …